EIA/JESDAB. Page 1. TEST METHOD AB. POWER AND TEMPERATURE CYCLING. (From Council Ballot JCB, formulated under the. Find the most up-to-date version of JESDAA at Engineering 4. Power Temp. Cycling. (PTC) JESDA /+°C, If = 20mA on/off = 5min. hrs. 5. Steady state life test. (SSLT) JESDA
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The power should then be applied and suitable checks made to assure that all devices are properly biased. The test setup should be monitored initially and at the conclusion of a test interval to establish that all devices are being stressed to the specified requirements. O ther su gges tio ns for d ocu men t impro vemen t: It is intended for device qualification. The temperature of the sample should be within a few degrees of the ambient temperature during the temperature ramps.
For samples without a thermal mass constraint, the ramp jesd2 can be faster. The power and temperature cycling test is considered destructive. Sockets or other mounting means shall be provided within the chamber so that reliable electrical contact can be made to the device terminals in the specified circuit configuration.
The test circuitry should also be designed so that existence of abnormal or failed devices does not a15 the specified conditions for other units on jeed22.
Effect of YMnO3 mesd22 the A combined power and e JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally.
Care should be taken to avoid possible jjesd22 from transient voltage spikes or other conditions that might result in electrical, thermal, or mechanical overstress. Precautions should be taken to avoid electrical damage and thermal runaway. By downloading this file jsed22 individual agrees not to charge for or resell the resulting material.
I rec ommen d cha nges to the fo llow in g: The low temperature to high temperature transition or reverse sequence is acceptable. The power and temperature cycling test is performed to kesd22 the ability of a device to withstand alternate exposures at high and low temperature extremes with operating biases periodically applied and removed. JEDEC standards and publications are adopted without regard to whether or not their mesd22 may involve patents or articles, materials, or processes.
Power supplies and biasing networks shall be capable of maintaining the specified operating conditions throughout the testing period despite normal variations in line voltages or ambient temperatures.
The device shall be subjected to the test conditions derived from Table 1 as illustrated in Figure 1. The electrical measurements shall consist of parametric and functional tests specified in the applicable specification.
POWER AND TEMPERATURE CYCLING
The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint.
Rec ommend a tions fo r cor rec tion: Direct heat conduction to sample s shall be minimized. Cycle ramp rate and soak time are more significant for solder interconnections. When testing these devices it jesc22 important to avoid transient thermal gradients in the samples on test. During the test, the power applied to the devices shall be alternately cycled 5 minutes on 5 minutes off unless otherwise specified in the applicable specification.
jed22 The time at the high and low temperature extremes shall be sufficient to allow the total mass of each device under test to reach the specified temperature extremes with no power applied. NOTE Power duty cycle is usually expressed as a percentage.
No claims to be in conformance with this standard may be made unless all requirements stated in the standard are met. Mechanical damage shall not include damage induced by fixturing or handling or the damage is not critical to the package performance in the specific application.
The devices shall concurrently be cycled between temperature extremes for the specified number of cycles. IGBT Power cycling and These include flip chip, ball grid array and stacked packages with jezd22 interconnections. A combined power cycle Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement.
Deviations must be corrected prior to hesd22 cycling to assure the validity of the qualification data. The power and temperature jese22 test shall be continuous except when parts are removed from jese22 chamber for interim electrical measurements.
Re qu ire men t, c la use n umber T es t me thod nu mber C laus e number F a x: Ramp rate can be load dependent and should be verified for the load being tested.
POWER AND TEMPERATURE CYCLING | JEDEC
If the test is interrupted as a result of power or equipment failure, the test may restart from the point of stoppage. Samples with large thermal mass and low heat transfer efficiency require ramp rates slow enough to compensate for the thermal mass. If liquid nitrogen LN2 is used, care must be taken to avoid direct exposure of the parts and boards to the LN2. It is intended to simulate worst case conditions encountered in typical applications.